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Sheet Resistance Measurement
Definition Sheet Resistance
Sheet resistance (Rs or R), also known as sheet rho, is a measure for the electrical resistance of thin layers. It is related to the resistivity of both material and layer thickness. The sheet resistance value (typically stated in Ω/sq or Ohm/sq or Ohm per square or OPS) provides a measure for the electrical characteristics of conductive and and semiconducting layers. It is the main physical parameter for describing the electrical performance of electrodes. The sheet resistance Rs correlates with the material thickness if the bulk resistivity can be assumed to be constant. The formula is
ρ = RS · t where ρ is the resistivity; RS is the sheet resistance; and t is the thickness of the material |
Sheet resistance describes the ability of a square layer to conduct a certain current. This characteristic is the most important quality parameter for surface electrodes and is determined during layer deposition process or for quality assurance of conductive thin films.
Sheet Resistance Measurement Unit
Even though the correct physical unit of sheet resistance or sheet resistivity is Ohm, the unit most commonly used is Ohm/ sq.
The sheet resistance is specified in Ohm/sq or OPS, in order to achieve a differentiation for the general resistance, which is indicated in Ohm. Very thick layer and highly conductive layers are often described in mOhm/sq and low conductive material is often described using kOhm/sq or MOhm/sq.
Sheet Resistance Measurement Techniques
There are two different modes to measure the sheet resistance-non-contact and contact. Non-contact sheet resistance measurement is possible with the following techniques:
Methods for Sheet Resistance Measurements
Sheet Resistance Measurement by Eddy Current Testing (EC)
Eddy current sheet resistance testing devices drive an alternating current (AC) through coils to generate a (primary) electromagnetic field that induces so called (eddy) currents in conductive materials. The induced currents in the test object operate with the same AC frequency as applied to the induction coils resulting in a secondary field which is opposed to the primary field. The sum of both fields or the change in fields describes the sheet resistance.
Sheet Resistance Measurement by Four-Point-Probe Testing (2PP/ 4PP)
The four-point-probe method works by contacting four equally-spaced, co-linear probes to the material. This method is known as a four-point probe method. A direct current (DC) is driven between the outer two probes whereas the voltage is measured between the inner two probes. Often a geometric correction factor is required when measuring on small samples or close to edges, where current pathways are affected by the sample geometry. The most accurate values can be obtained in the center of samples.
Comparison of 4PP and EC Sheet Resistance Testing
Eddy Current, 4PP, Hall-Effect and Van-der-Pauw methods are electrical testing methods applicable for testing of the electrical parameter sheet resistance. Hall-Effect and Van-der-Pauw measurements are applied on R&D level since both methods typically require sample preparation. Industry is commonly using contact 4PP and non-contact Eddy Current (EC) measurements which do not require sample preparation. The key differences are summarized in the next image.
Eddy Current Testing allows accurate measurement without impacts due to inhomogeneous contact quality, without damaging any sensitive surface or inducing artifacts due to contacting. Furthermore, it allows the accurate measurement of inaccessibly buried or encapsulated layers. Applying non-contact technology, there is no wear of needles or tips, which typically causes high replacement costs in common 4-point-probe mapping systems. A further significant advantage is the short measurement time. A measurement takes only a few milliseconds for each measurement and no time for contacting the sample is needed. This also allows to measure inline during production or “on the fly” in mapping systems. In result, the eddy current sheet resistance mapping systems measure thousands of positions in a couple of seconds. No interpolation between measurements points – as typical in 4-point-probe mapping systems – is required. Hence, defects and non-uniform areas can be identified.
Sheet Resistance Measurements by Eddy Current
Eddy current gauges are applied for sheet resistance testing since 30 years. Its accuracy and its ability to measure in contactless mode has a special user value. Key benefits of eddy current resistance testing are:
- Non-contact mode
- Ultra-fast (20 ms / measurement)
- High repeatability and accuracy
- Large distances from sensor to substrate
- Transmission mode and reflective mode
- Measurement through encapsulation
- No wearing
- Large measurement range from 0.1 mOhm/sq to 100 kOhm/sq (9 decades)
Sheet Resistances Applications and Measurement Ranges
Sheet resistance is a key quality parameter in architectural glass, photovoltaics, display, OLED, touch panel sensors, packaging, semiconductor and many more industries. The following table provides an overview of typical sheet resistance values across different applications.
Sheet Resistance Measurement Standards
Several industries apply their own measurements standards for sheet resistance measurement using eddy currents devices. Examples are
- SEMI MF673 — Test Method for Measuring Resistivity of Semiconductor Wafers or Sheet Resistance of Semiconductor Films with a Noncontact Eddy-Current Gauge
- SEMI PV28 — Test Method for Measuring Resistivity or Sheet Resistance with a Single-Sided Noncontact Eddy-Current Gauge
- ASTM F1844 - 97(2016) — Standard Practice for Measuring Sheet Resistance of Thin Film Conductors For Flat Panel Display Manufacturing Using a Noncontact Eddy Current Gage
Sheet Resistance Measurement Devices from SURAGUS
Handheld Device
for Single Point Measurements
Tasks:
Fast random measurements of product quality at good receipt and after production of particularly large elements.
Handling:
The handheld uints is placed on the object to be examined.Then the"Measure"button is pressed and after one second the measured value appears on the dispaly.
Result:
The result of a mearurement is the value of the measured point.
Benchtop Device
for Single Point Measurements
Tasks:
Fast and high-precision,stationary random sample measurement of production quality at incoming and outgoing goods or before and after a production step to determine product quality in order to draw conclusions about process quality and stability.
Handling:
The specimen is positioned centered on the measuring field.The measured value is displayed immediately in the software.
If several measuring points on the specimen are of interest,the software supports the creation of a manual mapping with an input matrix.
Result:
The result is a single mearurement value,a manual multiple measurement in the form of a matrix or even a line profile.
Benchtop Device
for Full Area Images
Tasks:
Very detailed because full surface information of the product quality,in order to draw conclusions on the process quality and stability,as well as for the optimizaton of the process (use of resources,process speed) and the product (improvement of homogeneity,adherence to minimum values).
Handling:
The sample is positioned centered on the measuring field.Prefabricated holders are available for wafers,which guarantee centered support.Insert the sample.Close the flap and press"Start measurement".
Result:
The result is a false image representation of entire layere to be measured consisting of many thousands of individual measured values.
Inline-System
for Continuous Single Point
Measurements
Tasks:
Continuous information acquisition about process quality and stability as well as product quality before and/or after a production step.
production automation based on sensor information.
Handling:
The inline system is integrated into existing production line.The operator starts the measurement recording and the software stores all data in a datebase.
Result:
Depending on the configuraion,the result is one or more line profiles,centered or at noralgic points on the layer to be examined.
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